It adopts the method of non breaking vacuum and roll to roll,
and integrates one-stop online successively in the flexible substrate,deposition back electrode, CIGS absorption layer, CdS
buffer layer and i-ZnO/AZO window layer,etc. Deposition filmscan be customized according to client requirements；
The horizontal magnetron sputtering coating equipment uses the physical process to transfer atoms or molecules from
the material source to the substrate surface to complete the physical coating process. The equipment uses magnetron
sputtering method to realize the function of double-sided coating in one process, and splash TCO film on the front and back
sides of silicon wafer.