It adopts the method of non breaking vacuum and roll to roll,
and integrates one-stop online successively in the flexible substrate,deposition back electrode, CIGS absorption layer, CdS
buffer layer and i-ZnO/AZO window layer,etc. Deposition filmscan be customized according to client requirements；
The horizontal magnetron sputtering coating equipment uses the physical process to transfer atoms or molecules from
the material source to the substrate surface to complete the physical coating process. The equipment uses magnetron
sputtering method to realize the function of double-sided coating in one process, and splash TCO film on the front and back
sides of silicon wafer.
1) Takes the cell strings directly from the stringer and layup according to the design requirements of modules spec.
2）Compatible with the design specifications of the cell, and compatible with the horizontal and vertical arrangement
3）Grasp and place the cell strings accurately
4）The string grasping tooling can be replaced and compatible with different types of cell strings.
1）It is used for cutting, punching and cutting of packaging materials such as EVA, TPT, TPE, Pye and Poe of solar cell modules
2）This machine should be suitable for opening three-part and two-part EVA half piece double glass components and standardmodules.
3）Continuous feeding of EVA cutting machine :It has a hot-melt mechanism, which can be connected by hot-melt, and has the function of automatic joint throwing. There is no need to wear EVA again for refueling, and the function can be switched
1）Basic functions: take the frame from the material box, automatically load, locate, glue and group the frame
2）Glue overflow condition: there is no glue overflow on both sides of the component. Insert the paper into the glass surface profile for 5mm, and there must be glue; There is glue overflow at four corners, the glue line is flat, and the tolerance of glue width is ≤ 1mm (except for four corners)
3）There is no obvious gap at the junction of the frame, and the frame cannot be scratched or damaged in the full-automatic process